Semiconductorss mobile devices become increasingly compact and energy efficient, suppliers need to produce semiconductor chips that are thinner with a larger surface area. The market for semiconductor lithography equipment with greater Fan-Out Wafer Level Packaging (FOWLP) functionality continues to expand, reflecting increased demand for high-density redistribution layer wiring that requires high-resolution lithography.
To meet the evolving requirement of packaging trends, Canon Inc. has introduced the FPA-5520iV HR Option, a high-resolution addition to the existing Canon FPA-5520iV i-line stepper, a semiconductor lithography system that employs a 365nm wavelength mercury lamp as the light source. HR Option steppers also inherit such features as enhanced functionality for and increased productivity for semiconductor manufacturing processes.
While the FPA-5520iV achieves a resolution of 1.0µm, the FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8µm, the finest available in present packaging-oriented lithography systems. This advancement allows finer circuit patterning to enable the further miniaturization of semiconductor chips while allowing increasing data bandwidth and processing speeds.
The FPA-5520iV HR Option maintains the same basic functionality, performance and productivity of the FPA-5520iV stepper released in July 2016 for FOWLP processes while delivering a higher resolution of 0.8µm. The FPA-5520iV HR Option steppers provide improved productivity by offering such capabilities as handling extremely warped reconstituted wafers, a problem encountered during mass production using FOWLP technology, as well as an improved rate of operation by automatic detection of alignment marks of chips that are known to be placed non-uniformly on reconstituted wafers.
By continuing to provide a wide variety of solutions and upgrade options for its semiconductor lithography equipment, Canon supports users’ increasing productivity needs.